Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features

Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which...

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Bibliographic Details
Main Authors Niazimbetova, Zuhra, Scalisi, Mark, Hazebrouck, Rebecca, Thorseth, Matthew, Dziewiszek, Joanna
Format Patent
LanguageEnglish
Published 29.01.2019
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
Bibliography:Application Number: US201715451547