Method of manufacturing housing structure and housing structure

• Main Authors: Kajitani, Masafumi, Yao, Fu, Matsui, Noriaki, Hotta, Kensaku, Kosumi, Yuki, Takeuchi, Akihiro, Kutsumi, Hiroshi, Koyama, Shoichi, Yukimura, Takahiro, Moriuchi, Toshihiro, Haraguchi, Satoshi
• Format: Patent
• Language: English
• Published: 01.01.2019
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TESTING; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facin...