Multi-chip self adjusting cooling solution

• Main Authors: Smith, Susan F, Ortiz, Almanzo T, Smalley, Jeffory L, Prakash, Mani, Bosak, Henry C, Kofstad, Harvey R, Liu, Tao
• Format: Patent
• Language: English
• Published: 27.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger dis...