Electrodeposited copper foil with low repulsive force

The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75...

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Bibliographic Details
Main Authors Cheng, Kuei-Seng, Huang, Jian-Ming, Lai, Yao-Sheng
Format Patent
LanguageEnglish
Published 25.09.2018
Subjects
APPARATUS THEREFOR
AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
PUNCHING METAL
TRANSPORTING
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Summary:The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm2 to 55 kgf/mm2. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.
Bibliography:Application Number: US201715626877