Bond pad structure for bonding improvement

• Main Authors: Wang, Ming-Tsong, Yaung, Dun-Nian, Huang, Sin-Yao, Chou, Shih Pei, Wang, Ching-Chun, Hung, Feng-Chi
• Format: Patent
• Language: English
• Published: 31.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Some embodiments relate to a three-dimensional (3D) integrated circuit (IC). The 3DIC includes a first substrate including a photodetector which is configured to receive light in a first direction from a light source. An interconnect structure is disposed over the first substrate, and includes a plu...