Wafer-level back-end fabrication systems and methods

• Main Authors: Huang, Edward K, Bornfreund, Richard E, Hood, Andrew D, Gall, Bryan, Heu, Paula
• Format: Patent
• Language: English
• Published: 10.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

Systems and methods may be provided for fabricating infrared focal plane arrays. The methods include providing a device wafer, applying a coating to the device wafer, mounting the device wafer to a first carrier wafer, thinning the device wafer while the device wafer is mounted to the first carrier...