Heat dissipation assembly
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| Main Author | |
|---|---|
| Format | Patent |
| Language | Chinese English |
| Published |
01.07.2015
|
| Subjects | |
| Online Access | Get full text |
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| Author | CAI, CHENG-EN |
|---|---|
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| RelatedCompanies | XBRIGHT TECHNOLOGY CO., LTD |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Heat dissipation assembly |
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