TWI847313B
Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
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| Main Authors | , , , , , , , , |
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| Format | Patent |
| Language | Chinese |
| Published |
01.07.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path. |
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| AbstractList | Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path. |
| Author | SULLIVAN, JARED D WEHRLI, ANDREW J WARD, TODD D BARDELLA, GIANNI R MCGEE, MICHAEL SCHULZ, DARIAN JONES, ERAN J ISAAC, AYMAN GADER, DAVID |
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| Notes | Application Number: TW202211139788 |
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| PublicationDate | 20240701 |
| PublicationDateYYYYMMDD | 2024-07-01 |
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| RelatedCompanies | MOLEX, LLC |
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| Snippet | Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| Title | TWI847313B |
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