Systems and methods for improved semiconductor etching and component protection
Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber. The chamber may include a spacer characterized by a first surface with which the gas box is coupled, and the spacer may define a recessed ledg...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.07.2024
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Subjects | |
Online Access | Get full text |
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Abstract | Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber. The chamber may include a spacer characterized by a first surface with which the gas box is coupled, and the spacer may define a recessed ledge on an interior portion of the first surface. The chamber may include a support bracket seated on the recessed ledge that extends along a second surface of the spacer. The chamber may also include a gas distribution plate seated on the support bracket. |
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AbstractList | Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber. The chamber may include a spacer characterized by a first surface with which the gas box is coupled, and the spacer may define a recessed ledge on an interior portion of the first surface. The chamber may include a support bracket seated on the recessed ledge that extends along a second surface of the spacer. The chamber may also include a gas distribution plate seated on the support bracket. |
Author | LOH, LOK KEE TAN, TIEN FAK PARK, SOONAM CHOY, MARTIN YUE LUBOMIRSKY, DMITRY JUNG, SOONWOOK |
Author_xml | – fullname: LUBOMIRSKY, DMITRY – fullname: PARK, SOONAM – fullname: CHOY, MARTIN YUE – fullname: JUNG, SOONWOOK – fullname: LOH, LOK KEE – fullname: TAN, TIEN FAK |
BookMark | eNqNzD0KwkAQhuEttPDvDnMBi6Bg6oiilYUBy7DMTsyCO7NkRsHbu4gHsPrg5eGbuwkL08xdrm81SgqeAySyQYJCLyPElEd5UQClFFE4PNFKJsMh8v3LUVIuJ2xQqBFaFF66ae8fSqvfLhwcD-3-tKYsHWn2SEzWtbdzvd1VddU0mz_IB4rCObI |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | TWI847181BB |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_TWI847181BB3 |
IEDL.DBID | EVB |
IngestDate | Fri Oct 18 06:05:05 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_TWI847181BB3 |
Notes | Application Number: TW202211125531 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240701&DB=EPODOC&CC=TW&NR=I847181B |
ParticipantIDs | epo_espacenet_TWI847181BB |
PublicationCentury | 2000 |
PublicationDate | 20240701 |
PublicationDateYYYYMMDD | 2024-07-01 |
PublicationDate_xml | – month: 07 year: 2024 text: 20240701 day: 01 |
PublicationDecade | 2020 |
PublicationYear | 2024 |
RelatedCompanies | APPLIED MATERIALS, INC |
RelatedCompanies_xml | – name: APPLIED MATERIALS, INC |
Score | 3.6842499 |
Snippet | Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber.... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Systems and methods for improved semiconductor etching and component protection |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240701&DB=EPODOC&locale=&CC=TW&NR=I847181B |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ7Uaqw3rZrWV_ZguBFpYcUeiAkLpJq0NAZtb80uj7QXaITGxF_v7BbUi97Iwr6GzM43u7PfANyO7EwY3M50kZqxbo0yS-cZHeh2LJPYIYIYqqwlk-n9-NV6XtBFC1bNXRjFE_qhyBFRo2LU90qt15ufTSxPxVaWd2KNRcVjEDmeVnvH0j1B39hzHX8WeiHTGHOiuTZ9cZ7UKjxw92AfQbQtdcF_c-WdlM1vgxIcw8EM28qrE2h9rrrQYU3etS4cTurjbnysNa88hbCmFifo-ZNd2ueSIOAka7UrkCaklGHuRS75W7FY_g20SupzGTZe5NgbqVkZcHpnQAI_YmMdR7b8FsIymjdTcM1zaOdYrQfkgYoEERSnWWJYqWlLNMZNngo6TIyExn3o_9nMxT_vLuFISnMXl3oF7ep9m16j9a3EjRLcF4CZjJg |
link.rule.ids | 230,309,783,888,25576,76876 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ7Uaqw3rZrW5x4MNyItIPZATHiFaoHGoO2NsDzSXqARjIm_3tktqBe9kYV9DZmdb3ZnvwG4mWg5lWItF2kmJ6IyyRUxztWRqCUsiR0iiDHPWuL5d-6L8rhUlx1YtXdhOE_oBydHRI1KUN9rvl5vfjaxLB5bWd3SNRaVD06oW0LjHTP3BH1jy9DteWAFpmCaergQ_Gd9ylfhkbEDuwiwNaYL9qvB7qRsfhsU5xD25thWUR9B53PVh57Z5l3rw77XHHfjY6N51TEEDbU4Qc-fbNM-VwQBJ1nzXYEsJRULcy8Lxt-KxexvoFXin7Ow8bLA3kjDyoDTOwHi2KHpijiy6FsIUbhop2DIp9AtsNoAyL1KU0RQsZqnkpLJGkNjsRxnVB2nUqomQxj-2czZP--uoeeG3iyaTf2nczhgkt3GqF5At357zy7REtf0igvxC0Sxj4s |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Systems+and+methods+for+improved+semiconductor+etching+and+component+protection&rft.inventor=LUBOMIRSKY%2C+DMITRY&rft.inventor=PARK%2C+SOONAM&rft.inventor=CHOY%2C+MARTIN+YUE&rft.inventor=JUNG%2C+SOONWOOK&rft.inventor=LOH%2C+LOK+KEE&rft.inventor=TAN%2C+TIEN+FAK&rft.date=2024-07-01&rft.externalDBID=B&rft.externalDocID=TWI847181BB |