Method for measuring and correcting misregistration between layers in a semiconductor device, and misregistration targets useful therein
A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.03.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers of a semiconductor device wafer at a second instance and providing a second misregistration indication, providing a misregistration measurement difference output in response to a difference between the first misregistration indication and the second misregistration indication, providing a baseline difference output and ameliorating the difference between the misregistration measurement difference output and the baseline difference output. |
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Bibliography: | Application Number: TW20209103938 |