Substrate processing apparatus and substrate processing method

• Main Authors: MITSUBAYASHI, TAKESHI, MORII, TAKAAKI, OE, MUNEAKI
• Format: Patent
• Language: Chinese; English
• Published: 21.02.2024
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

To reduce a length of a substrate processing apparatus.SOLUTION: A substrate processing apparatus comprises: an approach passage part where a substrate is moved from a region where the substrate is conveyed from an indexer device to an interface part; and a return passage part where the substrate is moved from the interface part to the region where the substrate is conveyed toward the indexer device. The return passage part includes a first part and a second part which each are positioned along a first horizontal direction. The first part contains a development part that executes development processing onto a coated film onto the substrate. The second part contains a cooling part for cooling the substrate heated by a heating part after the development processing. In the case where it is viewed from an upper direction, a first region constructing one part in the first horizontal direction of a first part and a second region constructing at least one part in the first horizontal direction of the second part are