Sensor assembly for chamber condition monitoring

Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-d...

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Bibliographic Details
Main Authors PAN, YAOLING, TEDESCHI, LEONARD, TAE, PATRICK JOHN, WILLWERTH, MICHAEL D, MCCORMICK, DANIEL THOMAS
Format Patent
LanguageChinese
English
Published 21.02.2024
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Summary:Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.
Bibliography:Application Number: TW202110102436