Methods of etching conductive features, and related devices and systems
A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resis...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
21.10.2023
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Subjects | |
Online Access | Get full text |
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Abstract | A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material. Systems and devices relate to devic |
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AbstractList | A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material. Systems and devices relate to devic |
Author | SHPAISMAN, Nava FRENKEL, Moshe |
Author_xml | – fullname: SHPAISMAN, Nava – fullname: FRENKEL, Moshe |
BookMark | eNqNyjsKwkAURuEptPC1h7sALcQUpk2Ij8IuYBmGmX-SgXgn5N4E3L0gLsDqwMdZmwUnxspcH9AueaEUCOq6yC25xH5yGmdQgNVphOzJsqcRvVV48pijg3xN3qJ4ydYsg-0Fu183hi5VXd4OGFIDGawDQ5v6eT8f8yzPiuL0x_IBI2o1yA |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | TWI819494BB |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_TWI819494BB3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 12:56:48 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_TWI819494BB3 |
Notes | Application Number: TW202211105647 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231021&DB=EPODOC&CC=TW&NR=I819494B |
ParticipantIDs | epo_espacenet_TWI819494BB |
PublicationCentury | 2000 |
PublicationDate | 20231021 |
PublicationDateYYYYMMDD | 2023-10-21 |
PublicationDate_xml | – month: 10 year: 2023 text: 20231021 day: 21 |
PublicationDecade | 2020 |
PublicationYear | 2023 |
RelatedCompanies | Kateeva, Inc |
RelatedCompanies_xml | – name: Kateeva, Inc |
Score | 3.6347158 |
Snippet | A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | Methods of etching conductive features, and related devices and systems |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231021&DB=EPODOC&locale=&CC=TW&NR=I819494B |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5qFfWmVbG-2IPkZLBNtok5BCFJYxX6QKLtrWRf1EtSTETw1zu7tupFb8ssLLMDM9_M7s63AJdCMa8jfMd2uaQ2IrRAl_K43eF5R_WE70pPNwoPR97giT7MerMGLNa9MIYn9N2QI6JHcfT32sTr5c8hVmLeVlbX7AVF5W2ahYm1qo51suJ0rSQK-5NxMo6tOA6zqTV6DO8R-WhAow3Y1Em0ZtnvP0e6J2X5G1DSPdia4FpFvQ-Nj0ULduL1v2st2B6urrtxuPK86gDuhuar54qUimhLI-IQLGU1WyvGK6KkIeisrkheCGIaVKQgQpo4YGRflM3VIZC0n8UDGzWaf29-nk3XqkfuETSLspDHQHx2w6WieSAYpgSOz0SQK6wkHJc7inHahvafy5z8M3cKu9qKOjg73TNo1q9v8hxRt2YXxmCfB_GJqA |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8JAEJ4gGvGmqBGfezA92QhtaeXQmLQFQSkQU4Ub6b6Cl5bYGhN_vbMrqBe9bWaTzewkM9_M7s63AJdcUrfJPcu0mXBMRGiOLuUys8nSpmxzzxauahSOR27_ybmftWcVWKx7YTRP6LsmR0SPYujvpY7Xy59DrEi_rSyu6QuK8tte4kfGqjpWyYrVMqLA707G0Tg0wtBPpsbo0R8g8jkdJ9iATU9x86rE6TlQPSnL34DS24WtCa6VlXtQ-VjUoRau_12rw3a8uu7G4crzin24i_VXzwXJJVGWRsQhWMoqtlaMV0QKTdBZXJE040Q3qAhOuNBxQMu-KJuLAyC9bhL2TdRo_r35eTJdqx7Yh1DN8kwcAfHoDRPSSTucYkpgeZR3UomVhGUzS1LmNKDx5zLH_8xdQK2fxMP5cDB6OIEdZVEVqK3WKVTL1zdxhghc0nNtvE-hD4yV |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Methods+of+etching+conductive+features%2C+and+related+devices+and+systems&rft.inventor=SHPAISMAN%2C+Nava&rft.inventor=FRENKEL%2C+Moshe&rft.date=2023-10-21&rft.externalDBID=B&rft.externalDocID=TWI819494BB |