Printed circuit board

A printed circuit board according to an aspect of the present invention includes a first insulating layer; a plurality of second insulating layers stacked on the upper surface of the first insulating layer; a plurality of third insulating layers stacked on the lower surface of the first insulating l...

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Bibliographic Details
Main Authors OH, NAM-KEUN, OH, HAE-SUNG, SIM, KI-JOO, KIM, SUNG-HOON, LEE, JIN-UK, KIM, YONG-MIN, KIM, AE-RIM
Format Patent
LanguageChinese
English
Published 11.05.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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