Printed circuit board

• Main Authors: OH, NAM-KEUN, OH, HAE-SUNG, SIM, KI-JOO, KIM, SUNG-HOON, LEE, JIN-UK, KIM, YONG-MIN, KIM, AE-RIM
• Format: Patent
• Language: Chinese; English
• Published: 11.05.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A printed circuit board according to an aspect of the present invention includes a first insulating layer; a plurality of second insulating layers stacked on the upper surface of the first insulating layer; a plurality of third insulating layers stacked on the lower surface of the first insulating layer; a first via formed in the first insulating layer; and a second via formed through all the second insulating layers so as to be connected to the first via vertically. The length ratio of a major axis to minor axis in the cross section of each of the first via and the second via is greater than one. An area difference between the upper surface and the lower surface of the first via is larger than an area difference between the upper surface and the lower surface of the second via. The heat dissipation of the printed circuit board can be improved.