Substrate for flexible devices
The present invention provides a substrate for flexible device. The substrate includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nick...
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| Main Authors | , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
11.04.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention provides a substrate for flexible device. The substrate includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nickel plating layer. The substrate is excellent in antirust property, moisture barrier property and adhesion of the glass layer, and also excellent in bending resistance and surface smoothness of the glass layer. |
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| AbstractList | The present invention provides a substrate for flexible device. The substrate includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nickel plating layer. The substrate is excellent in antirust property, moisture barrier property and adhesion of the glass layer, and also excellent in bending resistance and surface smoothness of the glass layer. |
| Author | NANBU, KOUJI MIYAZAKI, TOSHIHIKO MASUDA, HIROHISA SHIMOMURA, HIROSHI |
| Author_xml | – fullname: SHIMOMURA, HIROSHI – fullname: MIYAZAKI, TOSHIHIKO – fullname: NANBU, KOUJI – fullname: MASUDA, HIROHISA |
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| Notes | Application Number: TW20187121206 |
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| PublicationDateYYYYMMDD | 2023-04-11 |
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| RelatedCompanies | TOYO SEIKAN GROUP HOLDINGS, LTD |
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| Snippet | The present invention provides a substrate for flexible device. The substrate includes a stainless steel sheet, a nickel plating layer formed on a surface of... |
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| SubjectTerms | APPARATUS THEREFOR CHEMISTRY ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| Title | Substrate for flexible devices |
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