Two steps l-shaped selective epitaxial growth
The present disclosure provides a method of processing a semiconductor device having a stack formed over a source sacrificial layer above a substrate, a channel structure extending vertically through the stack and the source sacrificial layer, a gate line cut trench extending vertically through the...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.09.2022
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Subjects | |
Online Access | Get full text |
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