Two steps l-shaped selective epitaxial growth

The present disclosure provides a method of processing a semiconductor device having a stack formed over a source sacrificial layer above a substrate, a channel structure extending vertically through the stack and the source sacrificial layer, a gate line cut trench extending vertically through the...

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Bibliographic Details
Main Authors LIU, XIAO XIN, XUE, LEI, GENG, WAN BO, SHIUE, CHIAANN, HUANG, BO, GAO, TING TING
Format Patent
LanguageChinese
English
Published 01.09.2022
Subjects
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