Semiconductor device and controlling method thereof

A semiconductor device is disclosed, which includes a microcontroller and a flash memory. The microcontroller comprises a processing unit, bonding pads and switches. The microcontroller has a pass-through mode and a normal mode. In the normal mode, the external device is electrically connected to th...

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Main Authors CHEN, CHIHIEN, CHANG, PAO-SHU
Format Patent
LanguageChinese
English
Published 01.05.2022
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
INFORMATION STORAGE
PHYSICS
STATIC STORES
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Abstract A semiconductor device is disclosed, which includes a microcontroller and a flash memory. The microcontroller comprises a processing unit, bonding pads and switches. The microcontroller has a pass-through mode and a normal mode. In the normal mode, the external device is electrically connected to the processing unit via a pin and a first bonding pad of the microcontroller, and the processing unit is electrically connected to the flash memory via a second bonding pad of the microcontroller and a third bonding pad of the flash memory, so that the external device can program and verify the flash memory indirectly. In the pass-through mode, the external device is electrically connected to the flash memory the pin, the first bonding pad of the microcontroller, the second bonding pad of the microcontroller, and the third bonding pad of the flash memory, whereby the external device can communicate with the flash memory directly.
AbstractList A semiconductor device is disclosed, which includes a microcontroller and a flash memory. The microcontroller comprises a processing unit, bonding pads and switches. The microcontroller has a pass-through mode and a normal mode. In the normal mode, the external device is electrically connected to the processing unit via a pin and a first bonding pad of the microcontroller, and the processing unit is electrically connected to the flash memory via a second bonding pad of the microcontroller and a third bonding pad of the flash memory, so that the external device can program and verify the flash memory indirectly. In the pass-through mode, the external device is electrically connected to the flash memory the pin, the first bonding pad of the microcontroller, the second bonding pad of the microcontroller, and the third bonding pad of the flash memory, whereby the external device can communicate with the flash memory directly.
Author CHANG, PAO-SHU
CHEN, CHIHIEN
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Snippet A semiconductor device is disclosed, which includes a microcontroller and a flash memory. The microcontroller comprises a processing unit, bonding pads and...
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SubjectTerms CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
INFORMATION STORAGE
PHYSICS
STATIC STORES
Title Semiconductor device and controlling method thereof
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