TWI754078B

• Main Authors: HATAKEYAMA, ERI, KOBAYASHI, KENICHI, KUROKI, KUNIHIRO
• Format: Patent
• Language: Chinese
• Published: 01.02.2022
• Subjects: ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTIONOF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, ORTHE LIKE; ADHESIVES; ARTIFICIAL STONE; BUILDING; BUILDING IMPLEMENTS OR OTHER BUILDING AIDS, OR THEIRUSE; CEMENTS; CERAMICS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES; CORRECTING FLUIDS; DYES; FILLING PASTES; FIXED CONSTRUCTIONS; FORMS; HANDLING BUILDING MATERIALS ON THE SITE; INKS; LIME, MAGNESIA; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; REFRACTORIES; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTINGBUILDINGS; SCAFFOLDING; SHUTTERING; SLAG; TREATMENT OF NATURAL STONE; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention provides a radical polymerizable resin composition which is curable at low temperature and exhibits superior adhesion strength, and a structure-repairing material using the radical polymerizable resin composition. The present invention pertains to: a radical polymerizable resin composition characterized by containing (A) a radical polymerizable resin, (B) a radical polymerizable unsaturated monomer, (C) an amine curing accelerator, and (D) a polyfunctional thiol compound; and a structure-repairing material using the radical polymerizable resin composition.