TWI751092B

• Main Authors: KAWANISHI, MICHIROU, HIRAYAMA, TAKAMASA, NISHIO, AKINORI
• Format: Patent
• Language: Chinese
• Published: 21.12.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

Provided is an adhesive tape which contains thermally expandable microspheres, has excellent peelability after heating, and has little adhesive residue on an adherend. The adhesive tape according to the present invention is provided with a substrate and an adhesive layer disposed on at least one surface of the substrate, the adhesive layer containing thermally expandable microspheres, and when the adhesive tape is heated at a heating rate of 3 DEG C/min in thermomechanical analysis, the deformation start point is set as A point, and the deformation start point is set as B point. The time from point A to point B is 45-200 seconds, where the point at which the adhesive tape expands after passing through point A and the amount of deformation of the adhesive tape reaches the maximum is set as point C, and the point at which the amount of deformation reaches half of the amount of deformation at point C during the period from point A to point C is set as point B.