Semiconductor device package and semiconductor apparatus

• Main Authors: IM, YUN HYEOK, SHIN, TAEK KYUN, LEE, HEE SEOK, JO, CHA JEA
• Format: Patent
• Language: Chinese; English
• Published: 11.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semicond...