Semiconductor device package and semiconductor apparatus
A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semicond...
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| Main Authors | , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
11.12.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole. |
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| AbstractList | A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole. |
| Author | IM, YUN HYEOK LEE, HEE SEOK SHIN, TAEK KYUN JO, CHA JEA |
| Author_xml | – fullname: IM, YUN HYEOK – fullname: SHIN, TAEK KYUN – fullname: LEE, HEE SEOK – fullname: JO, CHA JEA |
| BookMark | eNrjYmDJy89L5WSwCE7NzUzOz0spTS7JL1JISS3LTE5VKEhMzk5MT1VIzEtRKEZRkFhQkFiUWFJazMPAmpaYU5zKC6W5GRTcXEOcPXRTC_LjU4uBJqTmpZbEh4R7mptYGhkaOTkZE6EEAPzxMLc |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | TWI749212BB |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_TWI749212BB3 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 14:24:19 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | Chinese English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_TWI749212BB3 |
| Notes | Application Number: TW20187112448 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211211&DB=EPODOC&CC=TW&NR=I749212B |
| ParticipantIDs | epo_espacenet_TWI749212BB |
| PublicationCentury | 2000 |
| PublicationDate | 20211211 |
| PublicationDateYYYYMMDD | 2021-12-11 |
| PublicationDate_xml | – month: 12 year: 2021 text: 20211211 day: 11 |
| PublicationDecade | 2020 |
| PublicationYear | 2021 |
| RelatedCompanies | SAMSUNG ELECTRONICS CO., LTD |
| RelatedCompanies_xml | – name: SAMSUNG ELECTRONICS CO., LTD |
| Score | 3.4995008 |
| Snippet | A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Semiconductor device package and semiconductor apparatus |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211211&DB=EPODOC&locale=&CC=TW&NR=I749212B |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5qFfWmVbG-yEFyCybNJtkcgpAXVegDjba3kqQbWoQkNCmCv97ZJfFxUNjDso9hdmBmd2ZnvwW41Zlt0tRKlYwaTCEmoQo1SKpQgjNiNlDNJY93jMbm8IU8zo15B1btWxiBE_ouwBFRo1LU91rY6_I7iOWL3MrqLlljU3EfRo4vN94xejNYZN91gunEn3iy5znRTB4_OQ8WsdFKuzuwyw_RHGU_eHX5m5Ty54YSHsHeFGnl9TF0PlY9OPDaf9d6sD9qrrux2mhedQL0mWexFzmHZy020pJxDZeQ9zc0CFKcL6Xq14C4FKDe2-oUpDCIvKGCLCy-VruIZi2vrn4G3bzI2TlINjqTCbHVVE1twgYksdQs1vWMJJrONKb1of8nmYt_-i7hkIuNJ2ho2hV0682WXeM2Wyc3QkKfuP2DbQ |
| link.rule.ids | 230,309,786,891,25594,76903 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5qFetNq9L6zEFyCybNNo9DEJI0pNqmRaPtreSxoSIkoUkR_PXOLq2Pg8Ieln0xOzAzfLMzswA3KjU1I9ETKTP6VCIaMSSjTxLJILgjoj1ZS5m_Yxxo_jO5n_fnDVhuc2F4ndB3XhwRJSpBea-5vi6_nVguj62sbuNXHCruvNByxQ06RjSDTXRtazCduBNHdBwrnInBozXUiYla2t6BXR0BIQdKLzbLSSl_GhTvEPameFZeH0HjY9mGlrP9d60N--PNczd2N5JXHYPxxKLYi5yVZy1WQkqZhAtI-xsqBCHKU6H6tSAqeVHvdXUCgjcIHV9CEhZft12Esy2ttnoKzbzIaQcEE8FkTEw5kROT0B6JdTmLVDUjsaJShSpd6P55zNk_c9fQ8sPxaDEaBg_ncMBYyII1FOUCmvVqTS_R5NbxFefWJwOmhlc |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Semiconductor+device+package+and+semiconductor+apparatus&rft.inventor=IM%2C+YUN+HYEOK&rft.inventor=SHIN%2C+TAEK+KYUN&rft.inventor=LEE%2C+HEE+SEOK&rft.inventor=JO%2C+CHA+JEA&rft.date=2021-12-11&rft.externalDBID=B&rft.externalDocID=TWI749212BB |