Positive-type photosensitive resin composition for micro lens pattern production and application thereof

The present invention provides a photosensitive resin composition which can cope with various exposure conditions and is applicable to making an industrial process for forming a micro lens efficient, and an application thereof. The positive-type photosensitive resin composition for micro lens patter...

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Main Authors GONSUI, SHINOBU, MATSUMOTO, NAOZUMI, IKEDA, YURI, INOUE, TOMOYUKI, ISOBE, SHINGO
Format Patent
LanguageChinese
English
Published 21.10.2021
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Abstract The present invention provides a photosensitive resin composition which can cope with various exposure conditions and is applicable to making an industrial process for forming a micro lens efficient, and an application thereof. The positive-type photosensitive resin composition for micro lens pattern production according to the present invention is characterized by comprising a resin (A) that has an acid dissociable dissolution inhibiting group and increases solubility to alkali by the action of acid, a compound (B) that includes a functional group for crosslinking the resin (A), and a photoacid generator (C). The photoacid generator (C) has light absorbance of 0.6 or more at a wavelength of 365 nm and a light absorbance of 0.75 or more at a wavelength of 248 nm. The light absorbance is measured at the following condition. The condition is that light absorbance of a propylene glycol monomethyl ether solution of the photoacid generator (C) having a weight mole concentration of 8.18x10-5 mol/kg is measured unde
AbstractList The present invention provides a photosensitive resin composition which can cope with various exposure conditions and is applicable to making an industrial process for forming a micro lens efficient, and an application thereof. The positive-type photosensitive resin composition for micro lens pattern production according to the present invention is characterized by comprising a resin (A) that has an acid dissociable dissolution inhibiting group and increases solubility to alkali by the action of acid, a compound (B) that includes a functional group for crosslinking the resin (A), and a photoacid generator (C). The photoacid generator (C) has light absorbance of 0.6 or more at a wavelength of 365 nm and a light absorbance of 0.75 or more at a wavelength of 248 nm. The light absorbance is measured at the following condition. The condition is that light absorbance of a propylene glycol monomethyl ether solution of the photoacid generator (C) having a weight mole concentration of 8.18x10-5 mol/kg is measured unde
Author MATSUMOTO, NAOZUMI
IKEDA, YURI
GONSUI, SHINOBU
INOUE, TOMOYUKI
ISOBE, SHINGO
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Snippet The present invention provides a photosensitive resin composition which can cope with various exposure conditions and is applicable to making an industrial...
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SubjectTerms APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
Title Positive-type photosensitive resin composition for micro lens pattern production and application thereof
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