Apparatus for prevention of backside deposition in a spatial ald process chamber
Susceptor assemblies comprising a susceptor with a support post are described. The susceptor has a body with a top surface and a bottom surface. The top surface has a plurality of recesses therein. The support post is connected to the bottom surface of the susceptor to rotate the susceptor assembly....
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.08.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Susceptor assemblies comprising a susceptor with a support post are described. The susceptor has a body with a top surface and a bottom surface. The top surface has a plurality of recesses therein. The support post is connected to the bottom surface of the susceptor to rotate the susceptor assembly. The support post includes support post vacuum plenum in fluid communication with a susceptor vacuum plenum in the body of the susceptor. The support post also includes a purge gas line extending through the support post to a purge gas plenum in the body of the susceptor. |
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| AbstractList | Susceptor assemblies comprising a susceptor with a support post are described. The susceptor has a body with a top surface and a bottom surface. The top surface has a plurality of recesses therein. The support post is connected to the bottom surface of the susceptor to rotate the susceptor assembly. The support post includes support post vacuum plenum in fluid communication with a susceptor vacuum plenum in the body of the susceptor. The support post also includes a purge gas line extending through the support post to a purge gas plenum in the body of the susceptor. |
| Author | POLYAK, ALEXANDER S YUDOVSKY, JOSEPH |
| Author_xml | – fullname: POLYAK, ALEXANDER S – fullname: YUDOVSKY, JOSEPH |
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| Snippet | Susceptor assemblies comprising a susceptor with a support post are described. The susceptor has a body with a top surface and a bottom surface. The top... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| Title | Apparatus for prevention of backside deposition in a spatial ald process chamber |
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