Device substrate

• Main Authors: LIU, PIN-MIAO, LIN, KUNGNG, LAN, YUNG-HSIANG, LEE, WEN-HUI, LIN, MING-WEI
• Format: Patent
• Language: Chinese; English
• Published: 01.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A device substrate includes a first substrate, a second substrate, a plurality of first bonding pads, a plurality of second bonding pads, a plurality of first leads, and a plurality of second leads. The first and second bonding pads are separated from each other. The first bonding pads are arranged...