Atomic layer deposition chamber with thermal lid

Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing an...

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Main Authors JANGRA, VIKAS, RASHEED, MUHAMMAD M, CHANG, YU, CUI, ANQING, BU, KYOUNG-HO, GUNGOR, FARUK, WU, DIEN YEH, GANDIKOTA, SRINIVAS, KUANG, WILLIAM W, TANG, WEI V, YUAN, XIAOXIONG, YANG, YIXIONG
Format Patent
LanguageChinese
English
Published 01.07.2020
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Abstract Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; a first heating element to heat the central channel; a second heating element to heat the bottom surface of the lid plate; a remote plasma source fluidly coupled to the central channel; and an isolation collar coupled between the remote plasma source and the housing, wherein the isolation collar has an inner channel extending through the isolation collar to fluidly couple the remote plasma source and the central channel.
AbstractList Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; a first heating element to heat the central channel; a second heating element to heat the bottom surface of the lid plate; a remote plasma source fluidly coupled to the central channel; and an isolation collar coupled between the remote plasma source and the housing, wherein the isolation collar has an inner channel extending through the isolation collar to fluidly couple the remote plasma source and the central channel.
Author WU, DIEN YEH
CUI, ANQING
TANG, WEI V
YUAN, XIAOXIONG
YANG, YIXIONG
BU, KYOUNG-HO
GUNGOR, FARUK
JANGRA, VIKAS
CHANG, YU
RASHEED, MUHAMMAD M
GANDIKOTA, SRINIVAS
KUANG, WILLIAM W
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– fullname: GUNGOR, FARUK
– fullname: WU, DIEN YEH
– fullname: GANDIKOTA, SRINIVAS
– fullname: KUANG, WILLIAM W
– fullname: TANG, WEI V
– fullname: YUAN, XIAOXIONG
– fullname: YANG, YIXIONG
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Snippet Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing...
SourceID epo
SourceType Open Access Repository
SubjectTerms CHEMICAL SURFACE TREATMENT
CHEMISTRY
CLEANING
CLEANING IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
Title Atomic layer deposition chamber with thermal lid
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