Chip packaging structure and related inner lead bonding method

• Main Authors: TSENG, KUO-WEI, CHEN, POI, CHANG, YINGN
• Format: Patent
• Language: Chinese; English
• Published: 11.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A chip packaging structure includes a chip and a film substrate. The chip is formed with a gold bump, and the film substrate is formed with an inner lead, wherein the gold bump includes a first bonding surface and a plurality of side walls. The gold bump is electrically connected to the inner lead t...