Chip packaging structure and related inner lead bonding method
A chip packaging structure includes a chip and a film substrate. The chip is formed with a gold bump, and the film substrate is formed with an inner lead, wherein the gold bump includes a first bonding surface and a plurality of side walls. The gold bump is electrically connected to the inner lead t...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
11.02.2020
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Subjects | |
Online Access | Get full text |
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