Work polishing apparatus

• Main Authors: KASUO, MANABU, WADA, MASAKI, KOYAMA, HARUMICHI, MOROZUMI, YOICHI
• Format: Patent
• Language: Chinese; English
• Published: 11.12.2018
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a work polishing device capable of miniaturizing and simplifying the device.SOLUTION: The work polishing device 10 includes: a surface plate 14 having a top surface attached with an abrasive cloth and rotating within a horizontal plane; and a top ring 16 disposed above the surface plate 14 so as to be movable vertically and rotatable within the horizontal plane and holding a carrier plate 52 in which a workpiece is held in the undersurface, between the top ring 16 and the surface plate 14 to press the workpiece on the surface of the surface plate 14. In the work polishing device 10, the top ring 16 is provided with a stopper 50 for catching and retaining the carrier plate 52 that is placed on the surface plate 14, moves with the rotation of the surface plate 14 and enters a lower surface side of the top ring 16, in a polishing position.