TWI580544B
This invention discloses a vertical dicing device comprising an overturning unit and a first cutting unit. The overturning unit is used for overturning a to-be-cut polycrystalline silicon ingot from a horizontal state to a vertical state to make a first surface of the polycrystalline silicon ingot t...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese |
Published |
01.05.2017
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Subjects | |
Online Access | Get full text |
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Abstract | This invention discloses a vertical dicing device comprising an overturning unit and a first cutting unit. The overturning unit is used for overturning a to-be-cut polycrystalline silicon ingot from a horizontal state to a vertical state to make a first surface of the polycrystalline silicon ingot that has at least the shortest and longest sides of the polycrystalline silicon ingot, face the first cutting unit. The first cutting unit vertically moves towards the first surface to execute a first cutting operation, so that the polycrystalline silicon ingot is cut into a plurality of first crystal blocks. Due to the design of the overturning unit, the surface of the polycrystalline silicon ingot that has the shortest side can be used as a cut surface when the vertical dicing device executes the operation of cutting the polycrystalline silicon ingot each time, so that the span required by the cutting unit is reduced, the issues such as large size variation or uneven surface of the square long columnar crystal blo |
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AbstractList | This invention discloses a vertical dicing device comprising an overturning unit and a first cutting unit. The overturning unit is used for overturning a to-be-cut polycrystalline silicon ingot from a horizontal state to a vertical state to make a first surface of the polycrystalline silicon ingot that has at least the shortest and longest sides of the polycrystalline silicon ingot, face the first cutting unit. The first cutting unit vertically moves towards the first surface to execute a first cutting operation, so that the polycrystalline silicon ingot is cut into a plurality of first crystal blocks. Due to the design of the overturning unit, the surface of the polycrystalline silicon ingot that has the shortest side can be used as a cut surface when the vertical dicing device executes the operation of cutting the polycrystalline silicon ingot each time, so that the span required by the cutting unit is reduced, the issues such as large size variation or uneven surface of the square long columnar crystal blo |
Author | HUANG, SONG-XIU CAI, WANG-TING XU, YONG-QI LAN, MING-ZI |
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Notes | Application Number: TW20160135787 |
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Snippet | This invention discloses a vertical dicing device comprising an overturning unit and a first cutting unit. The overturning unit is used for overturning a... |
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Title | TWI580544B |
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