Anisotropic conductive adhesive composition film and semiconductor device
A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate o...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.04.2016
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Subjects | |
Online Access | Get full text |
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