Liquid optically clear adhesive lamination process control

Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second...

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Bibliographic Details
Main Authors HSU, SHIH MIN, WU, HENG HSI, GRESPAN, SILVIO, SUNG, KUO-HUA, LIU, CYRUS Y
Format Patent
LanguageChinese
English
Published 11.03.2016
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTROGRAPHY
GENERAL PROCESSES OF COMPOUNDING
HOLOGRAPHY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.
Bibliography:Application Number: TW20132132267