Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film, and semiconductor device

• Main Authors: KIM, HYUN WOOK, HAN, JAE SUN, UH, DONG SEON, NAMKUNG, HYUN HEE, SEO, JIN YOUNG, JUNG, KWANG JIN
• Format: Patent
• Language: Chinese; English
• Published: 21.09.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C...