TWI492810B

Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as require...

Full description

Saved in:
Bibliographic Details
Main Authors OHNISHI, TSUKASA, FUJIMAKI, REI, ISHIBASHI, SEIKO, YOSHIKAWA, SHUNSAKU
Format Patent
LanguageChinese
Published 21.07.2015
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as required and the remainder is made up by Sn.
Bibliography:Application Number: TW20121150095