Structure of the led package

An LED package device comprises a substrate, a first electrode, a second electrode, a reflector, an encapsulation layer and an LED die. The substrate includes a top surface and a bottom surface opposite to the top surface, wherein the first and the second electrodes are located on the top surface of...

Full description

Saved in:
Bibliographic Details
Main Authors HSU, SHIH YUAN, HONG, MENG HSIEN, HU, PI CHIANG
Format Patent
LanguageChinese
English
Published 21.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract An LED package device comprises a substrate, a first electrode, a second electrode, a reflector, an encapsulation layer and an LED die. The substrate includes a top surface and a bottom surface opposite to the top surface, wherein the first and the second electrodes are located on the top surface of the substrate. A sum of the areas of the first and the second electrodes on the top surface is smaller than ¼- the area of the top surface. Therefore, an increased contacting area between the reflector and the substrate is formed to enhance the tightness of the LED package device.
AbstractList An LED package device comprises a substrate, a first electrode, a second electrode, a reflector, an encapsulation layer and an LED die. The substrate includes a top surface and a bottom surface opposite to the top surface, wherein the first and the second electrodes are located on the top surface of the substrate. A sum of the areas of the first and the second electrodes on the top surface is smaller than ¼- the area of the top surface. Therefore, an increased contacting area between the reflector and the substrate is formed to enhance the tightness of the LED package device.
Author HONG, MENG HSIEN
HU, PI CHIANG
HSU, SHIH YUAN
Author_xml – fullname: HSU, SHIH YUAN
– fullname: HONG, MENG HSIEN
– fullname: HU, PI CHIANG
BookMark eNrjYmDJy89L5WSQCS4pKk0uKS1KVchPUyjJSFXISU1RKEhMzk5MT-VhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQFWpeakl8SHhnibmFsYWFk5OxkQoAQAfICVf
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID TWI478388BB
GroupedDBID EVB
ID FETCH-epo_espacenet_TWI478388BB3
IEDL.DBID EVB
IngestDate Fri Jul 19 13:56:10 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_TWI478388BB3
Notes Application Number: TW20110134686
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150321&DB=EPODOC&CC=TW&NR=I478388B
ParticipantIDs epo_espacenet_TWI478388BB
PublicationCentury 2000
PublicationDate 20150321
PublicationDateYYYYMMDD 2015-03-21
PublicationDate_xml – month: 03
  year: 2015
  text: 20150321
  day: 21
PublicationDecade 2010
PublicationYear 2015
RelatedCompanies ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
RelatedCompanies_xml – name: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
Score 3.0914204
Snippet An LED package device comprises a substrate, a first electrode, a second electrode, a reflector, an encapsulation layer and an LED die. The substrate includes...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Structure of the led package
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150321&DB=EPODOC&locale=&CC=TW&NR=I478388B
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsUw0STSzNDLTTTIwT9E1MUsz0LVIMknUNUoBnbdllJxiAh668PUz8wg18YowjWBiyIDthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5q0N4xsHVjbGSo5uJk6xrg7-LvrObsbBsSruYXZOtpYm5hbGHhxMzACmpEg07Zdw1zAu1JKUCuUNwEGdgCgGbllQgxMFVlCDNwOsPuXRNm4PCFTncDmdCcVyzCIBMMPui1tChVIT9NAdhqU8hJTVEAuj0bWCCIMii4uYY4e-gCrYmH-yg-JBzmHidjMQYWYEc_VYJBISk5xSwN2ICyMEg2AtUZSSbA3AZsD6QaAoM5ycRUkkESpzFSeOSkGbhAQQNaOWVkKMPAAnRvqiywKi1JkgOHAgDH43e7
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsUw0STSzNDLTTTIwT9E1MUsz0LVIMknUNUoBnbdllJxiAh668PUz8wg18YowjWBiyIDthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5q0N4xsHVjbGSo5uJk6xrg7-LvrObsbBsSruYXZOtpYm5hbGHhxMzAag7sEII7SmFOoD0pBcgVipsgA1sA0Ky8EiEGpqoMYQZOZ9i9a8IMHL7Q6W4gE5rzikUYZILBB72WFqUq5KcpAFttCjmpKQpAt2cDCwRRBgU31xBnD12gNfFwH8WHhMPc42QsxsAC7OinSjAoJCWnmKUBG1AWBslGoDojyQSY24DtgVRDYDAnmZhKMkjiNEYKj5w8A6dHiK9PvI-nn7c0AxcomECrqIwMZRhYgG5PlQVWqyVJcuAQAQCF9Xql
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Structure+of+the+led+package&rft.inventor=HSU%2C+SHIH+YUAN&rft.inventor=HONG%2C+MENG+HSIEN&rft.inventor=HU%2C+PI+CHIANG&rft.date=2015-03-21&rft.externalDBID=B&rft.externalDocID=TWI478388BB