TWI477229B

• Main Authors: KAMINO, KENJI, TOTOUGE, MASAYUKI, MORIMOTO, SYOHEI, KAWAKAMI, YOSHINORI
• Format: Patent
• Language: Chinese
• Published: 11.03.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provi...