TWI472152B

• Main Authors: SUGAMA, KAZUYOSHI, ONITSUKA, OSAMU
• Format: Patent
• Language: Chinese
• Published: 01.02.2015
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

A method for manufacturing a plurality of piezoelectric vibrators includes forming, in the lid substrate wafer, a plurality of cavity recesses forming a plurality of through-electrodes in and through the base substrate wafer; bonding the plural piezoelectric vibration members to the upper face of the base substrate wafer via routing electrodes; overlaying the base substrate wafer and the lid substrate wafer; bonding the base substrate wafer and the lid substrate wafer; and cutting the two bonded wafers into the plural piezoelectric vibrators. Forming the plurality of through-holes includes disposing electroconductive core members having two flat ends and a thickness substantially equal to that of the base substrate wafer, in the plurality of through-holes, and disposing connection members between the core members and the through-holes; and firing the connection members at a predetermined temperature to integrally fix the through-hole, the connection member and the core member to each other.