Method of forming pitch multipled contacts

Methods of forming electrically conductive and/or semiconductive features for use in integrated circuits are disclosed. Various pattern transfer and etching steps can be used, in combination with pitch-reduction techniques, to create densely-packed features. The features can have a reduced pitch in...

Full description

Saved in:
Bibliographic Details
Main Author TRAN, LUAN C
Format Patent
LanguageChinese
English
Published 21.07.2010
Subjects
Online AccessGet full text

Cover

Loading…