Flexible substrate for package
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
11.04.2008
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Subjects | |
Online Access | Get full text |
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Author | CHEN, PI CHANG HUANG, MIN O HUNG, TZUNG LI LEE, MING HSUN |
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RelatedCompanies | CHIPMOS TECHNOLOGIES INC CHIPMOS TECHNOLOGIES (BERMUDA) LTD |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Flexible substrate for package |
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