Flexible substrate for package

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Bibliographic Details
Main Authors HUNG, TZUNG LI, CHEN, PI CHANG, LEE, MING HSUN, HUANG, MIN O
Format Patent
LanguageChinese
English
Published 11.04.2008
Subjects
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Author CHEN, PI CHANG
HUANG, MIN O
HUNG, TZUNG LI
LEE, MING HSUN
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Flexible substrate for package
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