Ink composition

• Main Authors: HISHIDA, MASAHIRO, SHIMOYAMA, AKIO
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2024
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; USE OF MATERIALS THEREFOR; WELDING; WOODSTAINS; WORKING BY LASER BEAM

Provided is an ink composition with which it is possible to form a sintered body (conductor wiring, joint structure, etc.) capable of suppressing joint strength reduction due to a thermal shock. An ink composition according to the present invention comprises metal particles and a solvent, wherein th...