Ink composition

• Main Authors: HISHIDA, MASAHIRO, SHIMOYAMA, AKIO
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2024
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; USE OF MATERIALS THEREFOR; WELDING; WOODSTAINS; WORKING BY LASER BEAM

Provided is an ink composition with which it is possible to form a sintered body (conductor wiring, joint structure, etc.) capable of suppressing joint strength reduction due to a thermal shock. An ink composition according to the present invention comprises metal particles and a solvent, wherein the metal particles include metal nanoparticles having a particle size of 1-100 nm, metal submicrometer particles having a particle size of 101-1,000 nm, and metal micrometer particles having a particle size of 1,001-10,000 nm, the mass ratio (micrometer particles/submicrometer particles) of the metal micrometer particles to the metal submicrometer particles is less than 1.00, and the content ratio of the metal nanoparticles in the metal particles is not less than 8 mass%.