Method of manufacturing semiconductor package

• Main Authors: GU, JA-KYOUNG, KIM, MIN-SOO, JUNG, KYOUNG-OK, SHIM, JI-HYE
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of manufacturing a semiconductor package includes forming a plurality of conductive patterns on a substrate, forming a photoresist film over the substrate to cover the plurality of conductive patterns, forming a photoresist pattern from the photoresist film by a photolithography process usi...