Method of fabricating semiconductor device

• Main Authors: KIM, SANG-WOOK, OH, HEUNG-SUK, HAN, KYU-BIN
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a method of fabricating a semiconductor device using a curvilinear OPC method. The method of fabricating the semiconductor device includes performing an optical proximity correction (OPC) step on a layout to generate a correction pattern, the correction pattern having a curvilinear shape...