Package structure

A package structure includes a carrier plate, a redistribution layer and a plurality of dummy patterns. The redistribution layer is disposed on the carrier plate and includes plural dielectric layers and a plurality of conductive patterns disposed respectively in the dielectric layers. The dummy pat...

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Bibliographic Details
Main Authors WANG, POIANG, YU, WANGIEH, HSIAO, HSIA-TSAI, LIN, PON
Format Patent
LanguageChinese
English
Published 16.04.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package structure includes a carrier plate, a redistribution layer and a plurality of dummy patterns. The redistribution layer is disposed on the carrier plate and includes plural dielectric layers and a plurality of conductive patterns disposed respectively in the dielectric layers. The dummy patterns are disposed in the dielectric layers and on the redistribution layer respectively and separate from the conductive patterns.
Bibliography:Application Number: TW202110137951