Adhesive agent, adhesive sheet and flexible copper clad laminate

An object of the present invention is to develop an adhesive agent for flexible copper clad laminate, which can provide FCCL having both the performance equivalent to two-layer FCCL obtained by casting method and the higher productivity than that of two-layer FCCL obtained by laminate method, not ha...

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Bibliographic Details
Main Authors SUZUKI, TETSUAKI, KUROSAWA, INATARO
Format Patent
LanguageChinese
English
Published 16.03.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:An object of the present invention is to develop an adhesive agent for flexible copper clad laminate, which can provide FCCL having both the performance equivalent to two-layer FCCL obtained by casting method and the higher productivity than that of two-layer FCCL obtained by laminate method, not having defects to cause cracking or wrinkling of a copper foil or the like, and showing excellent dimensional stability, and to provide an adhesive sheet and a flexible copper clad laminate obtained by laminate method, which are produced by using the adhesive agent. The present invention provides an adhesive agent for flexible copper clad laminate, which adhesive agent is for adhering a copper foil to a polyimide film substrate which constitutes the flexible copper clad laminate, which adhesive agent contains a solvent-soluble polyimide, phenoxy resin having a glass-transition temperature (Tg) of 120 DEG C or less, epoxy resin and epoxy resin curing agent; an adhesive sheet and a flexible copper clad laminate using t
Bibliography:Application Number: TW202211122321