Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same
Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a workpiece handling system having an unwind assembly including an unwind spindle operative to support an unwind material roll of a workpiece, and a rewind assembly including a rewind spindle operative to support a rew...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.02.2023
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Subjects | |
Online Access | Get full text |
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