Electromagnetic wave shielding film and shielded printed wiring board

• Main Authors: TAJIMA, HIROSHI, YAMAUCHI, SIROU, KATSUKI, TAKAHIKO
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

Provided is an electromagnetic wave shielding film which is both permeable to volatile components and has shielding characteristics, and which exhibits a sufficiently high bending resistance. This electromagnetic wave shielding film comprises: an adhesive layer; a metal layer comprising a metal and layered on the adhesive layer; and an insulation layer layered on the metal layer. The electromagnetic wave shielding film is characterized in that: a plurality of openings are formed in the metal layer; the openings include island-shaped metal layer formation openings (A) in which at least one island-shaped metal layer is formed on the inside of the opening; and the island-shaped metal layer formation openings (A) include an island-shaped metal layer formation opening (A1) in which the total value of the area of the island-shaped metal layers of one island-shaped metal layer formation opening (A) is 40-80% of the area inside the outline of the one island-shaped metal layer formation opening (A).