Heat transfer body

A heat transfer body (10) of the present invention is provided with: a heat transfer part (20) comprising a metal; and a protruding part (30) installed on a surface of the heat transfer part (20) and extending from the heat transfer part (20). The protruding part (30) is provided with a core materia...

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Bibliographic Details
Main Author MORIUCHI, HIDEKI
Format Patent
LanguageChinese
English
Published 16.11.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A heat transfer body (10) of the present invention is provided with: a heat transfer part (20) comprising a metal; and a protruding part (30) installed on a surface of the heat transfer part (20) and extending from the heat transfer part (20). The protruding part (30) is provided with a core material (32) which is composed of a metal block, and a metal fiber structure body (34) which is welded around the core material (32).
Bibliography:Application Number: TW202211109623