Radiative ray-sensitive composition, cured film, method for producing the same, semiconductor element, and display element wherein the radiative ray-sensitive composition is capable of forming a cured film excellent in image development adhesion
The present invention provides a radiative ray-sensitive composition capable of forming a cured film excellent in image development adhesion. A radiative ray-sensitive composition comprises: a polymer selected from at least one of the group consisting of a polymer containing a structural unit (I) ha...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.11.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a radiative ray-sensitive composition capable of forming a cured film excellent in image development adhesion. A radiative ray-sensitive composition comprises: a polymer selected from at least one of the group consisting of a polymer containing a structural unit (I) having a group represented by formula (1) or an acid-dissociative group, and a siloxane polymer; a photoacid generator; and a silanol compound having a partial structure in which a hydrophobic group and a hydroxyl group are bonded to a silicon atom, and having no alkoxy group. In formula (1), R1 , R2 and R3 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group having 1 to 6 carbons, an alkyl group having 1 to 10 carbons, or a phenyl group, wherein one or more of R1 , R2 and R3 is an alkoxy group having 1 to 6 carbon atoms. "*" indicates a bonding bond. |
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Bibliography: | Application Number: TW202211116346 |