Resin composition and resin film, prepreg, laminated board, copper-clad plate and printed circuit board containing same

• Main Authors: ZENG, XIAN-PING, CHEN, GUANG-BING
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention relates to a resin composition, and a resin film, a prepreg, a laminated board, a copper-clad plate and a printed circuit board containing the same. The resin composition comprises a combination of thermosetting polyphenyl ether resin, vinyl organic silicon resin and a completely hydrogenated elastomer polymer; and based on 100 parts by weight of the sum of the addition amounts of the thermosetting polyphenyl ether resin, the vinyl organic silicon resin and the completely hydrogenated elastomer polymer, the addition amount of the completely hydrogenated elastomer polymer is 20-50 parts by weight. The copper-clad plate prepared from the resin composition provided by the invention has the characteristics of low dielectric constant, low dielectric loss, excellent thermo-oxidative aging resistance, high glass-transition temperature, high heat resistance, high peel strength, low water absorption rate and the like, and can be applied to scenes such as automobile radars in worse use environments.