Resin composition and use thereof

• Main Authors: GUAN, CHI-JI, ZENG, XIAN-PING, XU, YONG-JING, CHEN, GUANG-BING
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention relates to a resin composition and the use thereof. The resin composition comprises, in parts by weight, the following components: a thermosetting polyphenylene ether resin, a crosslinking agent, an epoxy silane oligomer, and a free radical initiator, wherein the crosslinking agent comprises a polyolefin resin with an unsaturated double bond; and the epoxy silane oligomer has a structure as represented by formula I. In the present invention, by means of the addition of the epoxy silane oligomer to a polyphenylene ether + polyolefin resin system, not only can the peeling strength and the interlayer bonding force be effectively improved, but the peeling strength and interlayer bonding force of a plate are also not affected by a temperature change during processing due to the fact that the epoxy silane oligomer is not readily volatile, such that the stability of the peeling strength and the interlayer bonding force are ensured, while the dielectric properties and the heat resistance of the